IChemshunipleyiti yokupolisha i-wafer ye-alumina/turn table yenziwe ngobunyulu obuphezulu obuyi-99.7-99.9% ye-alumina. I-ceramic ye-alumina ecocekileyo kakhulu inobulukhuni obubalaseleyo kunye nokumelana okuhle kokuguguleka kokupholisha i-wafer kwaye igcina imo entle yomphezulu ixesha elide. Yenziwe yi-PIBM. Lilungu leshishini le-semiconductor ngenxa yozinzo lwayo olungenakuthelekiswa nanto lobushushu kunye nobukhulu kunye nokumelana neendawo ezinzima zokucubungula izixhobo ze-microchip.
I-Chemical-Mechanical Planarization (CMP), eyaziwa ngokuba yi-Chemical-Mechanical Polishing, yiteknoloji kwinkqubo yokwenziwa kwezixhobo ze-semiconductor. Isebenzisa i-chemical corrosion kunye namandla oomatshini ukuthambisa ii-silicon wafers okanye ezinye izinto ze-substrate ngexesha lokucubungula.
Izixhobo ze-CMP zahlulwe kakhulu zibe ngamacandelo amabini: inxalenye yokupolisha kunye nenxalenye yokucoca. Inxalenye yokupolisha ineenxalenye ezi-4, ezizezi: ii-turntable zokupolisha ezi-3 kunye nemodyuli yokulayisha nokukhupha i-wafer. Inxalenye yokucoca inoxanduva lokucoca nokomisa i-wafer ukuze kufezekiswe "ukomisa nokufaka" i-wafer. Kwizixhobo zokupolisha zonke, ii-alumina ceramics zidlala indima ebalulekileyo.
Iiseramikhi ze-alumina zihlala zisetyenziselwa ukulungiselela iidiski zokupolisha i-wafer, ezifuna ubunyulu obuphezulu, ukuqina okuphezulu kweekhemikhali, kunye nolawulo olufanelekileyo lwemilo yomphezulu kunye noburhabaxa.
Idiski yokugaya ye-ceramic ye-Chemshun 99.7% Al2O3 yenziwe ngezinto ze-ceramic eziphambili, ezifanelekileyo ekugayweni kwezinto ezahlukeneyo, ngakumbi ekugayweni kwezinto ezibuthathaka ezifana nee-wafers, ii-ceramics kunye neglasi. Idiski yethu yokugaya ye-ceramic inokwenziwa ngobukhulu obahlukeneyo ngokweemodeli ezahlukeneyo zokugaya nokupolisha.
Ixesha leposi: Meyi-30-2025