Iiceramics zeAlumina eziPhambili ezingama-99.7%
Ubumsulwa obuphezulu be-Alumina Ceramics （Al2O3:>99.7%）
-Ipleyiti yokuPolisha yeWafer yeAlumina / Itafile yokuJika
-Ibhodi yesiseko ye-Alumina yoBuchule obuphezulu obukhulu beZixhobo zoMveliso ze-LCD
Izixhobo:
I-Alumina ecocekileyo ephezuluAl2O3:>99.7%
Isicelo:
Imizi-mveliso ye-semiconductor, i-petroleum, i-chemical, i-photovoltaic, i-LCD njl. njl., njengeenxalenye zoomatshini, iinxalenye ze-elektroniki, i-microwave induction disk, iinxalenye zokufakelwa. Ezifana nezixhobo zokwenza i-semiconductor, izixhobo ze-vacuum, izixhobo zokwenza i-liquid crystal kunye nezinye izinto. Umzekelo, ubungakanani obukhulu be-high-purity alumina ceramic Wafer Polishing Plate / Turn Table yinxalenye ebalulekileyo ye-CMP kwi-chemical mechanical polishing, i-Alumina Baseboard ye-LCD.
Iimbonakalo:
U-Al ococekileyo kakhulu2O399.7% -99.9%
Amandla aphezulu oomatshini
Ukumelana nokunxiba okuphezulu
Ukufakwa kombane okuphezulu
Ukuqina okuphezulu kweekhemikhali
Ukumelana kakuhle nobushushu kunye nokugqwala
Inzuzo yoMvelisi:
Sinepropathi yobukrelekrele ezimeleyo yenkqubo ye-PIBM Spontaneous Solidification, sivelisa ngobuchule izinto zeseramikhi ezintle ezikumgangatho ophezulu.
Itekhnoloji entsha ivula iingxaki zokuguqulwa nokuqhekeka kweendawo ezinkulu ezimanzi zeseramikhi kwinkqubo yokulungiselela, kwaye ukusebenza kwemveliso kuphuculwe kakhulu kwiindawo ezinkulu zeseramikhi ezilungiselelwe ngeendlela zemveli.
Ukupolisha i-alumina ceramics yeChemshun Ceramics ngesafire lapping wafer polishing yenziwe njengenkqubo yokuvelisa i-PIBM. Yiteknoloji ephucukileyo yangaphakathi. I-PIBM iphumelele ekusombululeni ingxaki ephambili yokuqhekeka kunye nokuguqulwa kwe-alumina ceramics enkulu. Itekhnoloji ye-PIBM iya kuvula elinye ifestile le-ceramics entle. Asivelisi nje kuphela ipleyiti yokupolisha i-alumina ceramic wafer ekumgangatho ophezulu, kodwa kunye nezinye ii-ceramics ezinkulu ezicocekileyo ezifana ne-1200x500x20mm ceramic substrates zezixhobo zokwenza i-LCD, ii-semiconductor delviery tracks, ii-vacuum parts, ii-mechanical parts general, ii-bulletproof ceramics.
Ubume kunye nobukhulu bemveliso
1. Ipleyiti yokuPolisha yeWafer yeAlumina / Itafile yokuJika. Idiski, ubungakanani bendandatho bungaphantsi kwe-850mm, ubukhulu buyi-45mm.
2. Ibhodi esisiseko yeAlumina yeLCD njengee-receptors zenkxaso/ipleyiti yokuthwala. Imile njengebhodi ende, ibha ende, ibhodi eyisikwere, ubungakanani bebhodi ebhityileyo engaphantsi kwe-1500*600mm, efana ne: 1200x500x20, 1400x900x30 njl.
3.Iireli zesikhokelo ezingaphantsi kwe-1000 * 45 * 45mm.
4. Iityhubhu ezingenanto, iisilinda, iityhubhu zombane ezingenanto, njl. Ngobungakanani obungaphantsi kwama-300 ~ 600 × L500mm.
5. Iimveliso ezenziwe ngokwezifiso ezineenxalenye ezahlukeneyo zemilo ziyamkelwa.
Ipharamitha Ephambili: (Yekhemikhali / Eyomzimba):
| Ipropati | Into | Iyunithi | Chemshun 99.7% Alumina Ceramics |
| Iipropati eziQhelekileyo | Icandelo eliphambili | ubuninzi% | 99.7-99.9 |
| Uxinano | gm/cc | 3.94-3.97 | |
| Umbala | - | I-Ivory | |
| Ukufunxwa kwamanzi | % | 0 | |
| Iipropati zoomatshini | Amandla okuGuquka (MOR) 20 ℃ | I-Mpa(psix10^3) | 440-550 |
| Imodulus ye-Elastic 20℃ | I-GPa (psix10^6) | 375 | |
| Ubunzima bukaVickers | I-Gpa(kg/mm2) R45N | >=17 | |
| Amandla Okugoba | I-Gpa | 390 | |
| Amandla okuThamba 25℃ | I-MPa(psix10^3） | 248 | |
| Ukuqina Kwaphuka (KI c) | I-Mpa* m^1/2 | 4-5 | |
| Iipropati zoBushushu | Ukuqhuba kwe-thermal (20℃) | W/mk | 30 |
| I-Coefficient yokwandiswa kweThermal (25-1000℃) | 1x 10^-6/℃ | 7.6 | |
| Ukumelana noTshabalalo oluTshisayo | ℃(∆ Tc) | 200 | |
| Ubushushu obuphezulu bokusetyenziswa | ℃ | 1700 | |
| Iipropati zoMbane | Amandla eDielectric (1MHz） | i-ac-kv/mm(ac v/mil) | 8.7 |
| I-Dielectric Constant (1 MHz) | 25℃ | 9.7 | |
| Ukumelana nomthamo | i-ohm-cm (25℃) | >10^14 | |
| i-ohm-cm (500℃) | 2×10^12 | ||
| i-ohm-cm (1000℃) | 2×10^7 |
Inkqubo yokubumba Inkqubo yokugqiba i-ceramic
Ukuqinisekisa umgangatho:
Imveliso nganye yeBatch ihlolwa kwilebhu yefektri nakwiZiko loHlolo leSizwe.
