I-99.7% ye-Alumina Wafer Polish Plate

Inkcazelo emfutshane:

I-Chemshun 99.7% Al2O3 I-substrate ye-Alumina njengesixhobo sokucoceka okuphezulu kunye nobukhulu obukhulu bezinto ezintsha, ineempawu ezibonakalayo ezibonakalayo kunye nabalinganiswa beekhemikhali ezizinzileyo, ixabiso elihle lithelekisa nezinye izinto.Ucoceko oluphezulu lwe-alumina luhlala luqhubeka luphuhliswa ngophando oluphezulu lwehlabathi kunye neekeramikhi eziphambili kunye neefektri zeceramic ezilungileyo.

I-99.7% ye-Alumina Wafer yokuNgcwelisa iPleyiti yokuNxibisa ngoomatshini beMichiza.Njengenxalenye ebalulekileyo yeCMP yekhemikhali yenkqubo yokupholisha ngoomatshini.I-CMP iyimfuneko ekuveliseni inkqubo yesafire kunye neWafer ye-semiconductors.

Chemshun Ceramics 'ucoceko eliphezulu 99.7 % alumina iiseramikhi isafire yokugudisa kunye neepleyiti lapping, Disc zimile njenge PIBM inkqubo yokuvelisa.Ubuchwephesha bayo obuphambili bangaphakathi.I-PIBM iphumelele ukusombulula ingxaki ephambili yokuqhekeka kunye nokuguqulwa kobukhulu obukhulu be-alumina ceramics.I-PIBM iteknoloji iya kuvula enye ifestile yeekeramics ezintle.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Isicelo

Njengoko i-Alumina ceramic wafer wafer kunye nesapphire lapping disks ezisetyenziswa kwi-semi-conductive, ukupolisha kwedayimane njl.

Inkqubo: Zonke iintlobo zenkqubo yokupholisha kunye ne-lapping, ezifana ne-CMP chemical polishing mechanical polishing, iMechanical polishing, Precision Polishing.

Uphawu

Ukucoceka okuphezulu kunye nokuqina kweekhemikhali
Amandla oMechanical aphezulu kunye nobunzima
Ukuxhathisa okuPhezulu kokuMnyama
Ukumelana nombane oPhezulu
Ukumelana nobushushu obuphezulu Ukuya kuthi ga kwi-1700ºC
Ukusebenza koKunyangwa ngokugqithisileyo kweAbrasion
Ukusebenza kakuhle kweInsulation
Lonke uhlobo Ubungakanani 180,360, 450, 600mm njl

Igama lemveliso	99.7 ukucoceka okuphezulu kweAlumina ceramic Ukupholisha iiDiscs zokuLapping
Izinto eziphathekayo	99.7% ialumina
Ubungakanani obuqhelekileyo	D180, 360, 450, 600mm, ubungakanani obulungiselelweyo bamkelwe.
Umbala	Uphondo lwendlovu
Isicelo	Inkqubo ye-Wafer kunye neSapphire CMP kwishishini le-semi-conductive
Min.Umyalelo	1Pic

Ulwazi lweMichiza / lomzimba

		Iyunithi	99.7 iiCeramics zeAlumina
Iipropati ngokuBanzi	Umxholo we-Al2O3	wt%	99.7-99.9
	Ukuxinana	gm/cc	3.94-3.97
	Umbala	-	Uphondo lwendlovu
	Ukufunxwa kwamanzi	%	0
Iipropati zoomatshini	Amandla e-Flexural(MOR) 20 ºC	Mpa(psix10^3)	440-550
	IModyuli yeElastic 20ºC	I-GPa (psix10^6)	375
	Vickers Ukuqina	I-Gpa(kg/mm2) R45N	>=17
	Ukugoba Amandla	Gpa	390
	Amandla okuqina kwama-25ºC	MPa(psix10^3)	248
	Ukuqina Kokwaphuka (KI c)	Mpa* m^1/2	4-5
Iimpawu zeThermal	I-Thermal conductivity (20ºC)	W/mk	30
	I-Coefficient yokwandiswa kweThermal(25-1000ºC)	1x 10^-6/ºC	7.6
	Ukunyangwa kweThermal Shock	ºC	200
	Ubushushu bokusetyenziswa okuphezulu	ºC	1700
Iimpawu zoMbane	Amandla eDielectric (1MHz)	ac-kv/mm(ac v/mil)	8.7
	IDielectric Constant(1 MHz)	25ºC	9.7
	Ukuxhathisa uMqulu	ohm-cm (25ºC)	>10^14
		ohm-cm (500ºC)	2×10^12
		ohm-cm (1000ºC)	2×10^7

Inkonzo

Samkela iiodolo zesiko.
Ukuba ufuna ukwazi ulwazi oluninzi ngemveliso, nceda uzive ukhululekile uqhagamshelane nathi kwaye siya kukunika eyona mveliso ifanelekileyo kunye nenkonzo ilungileyo!